UPDATE! Information for registrants, including room location, picking up badges, special event details, etc. have been posted here.

The Solid Modeling and Applications symposia series is an international forum for the exchange of recent research in solid modeling, shape modeling, and geometric computation, and their applications in analysis, design, and manufacturing as well as in the emerging biomedical, geophysical, and other areas. This highly successful conference is now held annually, alternating locations between the USA and other countries.

The 8th Solid Modeling Symposium will be held on the University of Washington campus located five miles north of downtown Seattle and twenty miles north of Sea-Tac International Airport. Seattle is known for its scenic beauty, temperate climate, and abundant cultural and recreational opportunities.

In addition to tutorials (Monday and Tuesday) and technical plenary sessions (Wednesday, Thursday, Frday), this year's symposium will feature vendor exhibits, a best paper award sponsored by Spatial Corporation, and a number of local tours, including a Boeing 777 plant tour. Selected papers presented at the Symposium will be published in special issues of CAD and JCISE.

The reception for this year's symposium will take place on an evening boat cruise of Seattle's Lake Union and Lake Washington. Click here for details.

E-mail questions and inquiries to sm03@ce.washington.edu.